GLASS CORE SUBSTRATES
PLANOPTIK specializes in advanced Glass Core Substrates, offering tailored solutions to meet the evolving demands of the semiconductor and microelectronics industries. Our products are divided into two key categories:
1. Structured Glass Substrates
PLANOPTIK’s Structured Glass Substrates are engineered with precision features, such as through-holes, cavities, and intricate microstructures. These substrates are ideal for cutting-edge applications, providing unmatched performance and flexibility.
Key Features and Benefits
Unparalleled Precision
Enables intricate designs with exceptional accuracy for advanced devices.
High Surface Quality
Ensures defect-free surfaces, crucial for high-performance applications.
Extensive Glass Portfolio
Offers a wide range of glass types with varying coefficients of thermal expansion (CTE), allowing optimal material selection for each specific application.
Customizable Solutions
Tailored to meet the unique requirements of MEMS, sensors, and optical systems.
Applications
- MEMS devices and sensors
- CMOS image sensors (CIS)
- Advanced optical systems
- High-frequency applications
2. Metallized Glass Substrates
PLANOPTIK’s Metallized Glass Substrates integrate high-performance copper metallization, making them a superior choice for 3D Wafer-Level Packaging (WLP) and Advanced Packaging. These substrates are designed to meet the highest standards in reliability and performance for applications requiring dense interconnects and precise material properties.
Key Features and Benefits
High-Density Interconnects
Enables the creation of fine redistribution layers (RDLs) for advanced device integration.
Thermal and Dimensional Stability
Provides reliable performance under demanding thermal and mechanical conditions.
Extensive Glass Portfolio
Features a broad selection of glass types with different CTEs, ensuring compatibility with diverse packaging and electronic requirements.
Complete In-House Manufacturing
From glass structuring to copper metallization, all processes are carried out in-house to guarantee consistent quality and reduced lead times.
Applications
- 3D integration in semiconductor packaging
- RF components and broadband modules
- Automotive electronics (e.g., RF and camera modules)
- Advanced 5G and high-frequency technologies
Why Choose PLANOPTIK?
With decades of expertise and a broad range of advanced glass materials, PLANOPTIK delivers high-quality Glass Core Substrates tailored to meet the specific needs of our customers. Our vertically integrated production ensures consistent quality, innovative designs, and reliable performance, making us a trusted partner in the global electronics market.
If you have a product idea or a project please do not hesitate to contact us!